july 2011 doc id 018849 rev 1 1/9 9 EMIF06-MSD04F3 6-line low capacitance ipad? for micro-sd card with emi filtering and esd protection features emi low-pass filter integrated pull up resistors to prevent bus floating when no card is connected 208 mhz clock frequency compatible with sdr104 mode (sd3.0) lead-free package benefits low power consumption easy layout thanks to smart pin-out configuration very low pcb space consumption high reliability offered by monolithic integration reduction of parasitic elements thanks to csp integration complies with the following standards: iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) application micro (t-flash) secure di gital memory card in: mobile phones communication systems description the EMIF06-MSD04F3 is a highly integrated device based on ipad technology offering two functions: esd protection to comply with iec standard, and emi filtering to reject mobile phone frequencies. figure 1. pin configuration (bump side) tm : ipad is a trademark of stmicroelectronics flip chip (16 bumps) 1 2 3 4 d c b a www.st.com
characteristics EMIF06-MSD04F3 2/9 doc id 018849 rev 1 1 characteristics figure 2. EMIF06-MSD04F3 configuration table 1. absolute ratings (limiting values) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 air discharge, card side contact discharge, card side air discharge, ic side contact discharge, ic side 15 8 2 2 kv t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. pin configuration pin signal pin signal a1 dat0 c1 cmd a2 dat1 c2 v ss a3 sddat1 c3 v ss a4 sddda0 c4 sdcmd b1 clk d1 dat3/cd b2 v cc d2 dat2 b3 v ss d3 sddat2 b4 sdclk d4 sddat3/cd vss vcc clk cmd dat0 dat1 dat2 dat3/cd sdclk sdcmd sddat0 sddat1 sddat2 sddat3/cd card side r1 r2 r3 r4 r5 r6 host side r7 r8 r9 r10 r11
EMIF06-MSD04F3 characteristics doc id 018849 rev 1 3/9 table 3. electrical characteristic symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 14 16 v i rm leakage current at v rm v rm = 3 v 0.1 a r1, r2, r3, r4, r5, r6 serial resistance tolerance 10 %, matching 2 % 36 40 44 r7, r8, r9, r10, r11 pull-up resistance tolerance 20 %, matching 2 % 20 25 30 k c line data line capacitance v = 1.8 v, f = 10 mhz, v osc = 30 mv 7.5 10 pf v = 2.9 v, f = 10 mhz, v osc = 30 mv 9 f 0 cut-off frequency s21 = -3 db 550 mhz t r ,t f rise and fall time c load = 10 pf, low-ref = 0.58 v, high-ref = 1.27 v 0.98 ns figure 3. s21 attenuation measurements figure 4. analog crosstalk measurements 100k 1m 10m 100m 1g -30 -25 -20 -15 -10 -5 0 clk dat0 dat1 dat2 dat3 cmd f (hz) s21 (db) 100k 1m 10m 100m 1g -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 clk-dat0 dat3-sddat0 f (hz) db
characteristics EMIF06-MSD04F3 4/9 doc id 018849 rev 1 figure 7. digital crosstalk measurements figure 5. line capacitance versus applied voltage (typical values) figure 6. line capacitance versus frequency (typical values) c line (pf) 0 1 2 3 4 5 6 7 8 9 10 11 12 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 f=10 mhz v osc =30 mv rms t amb =25 c v bias (v) c line (pf) v osc =30 mv rms t amb =25 c v bias =1.8 v v bias =2.9 v f (mhz) 1 10 100 500 8 7 6 5 4 3 2 1 0
EMIF06-MSD04F3 characteristics doc id 018849 rev 1 5/9 figure 8. host side response to iec 61000-4-2 (+8 kv contact discharge) on card side figure 9. host side response to iec 61000-4-2 (-8 kv contact discharge) on card side
layout recommendations EMIF06-MSD04F3 6/9 doc id 018849 rev 1 2 layout recommendations figure 10. layout recommendations 3 ordering information scheme figure 11. ordering information scheme clk dat0 cmd dat1 dat2 vss vcc vcc nc nc vss top view clk dat0 cmd dat1 dat3/cd dat2 input output top level second level dat3/cd emif 06 - msd 04 f3 emi filter number of lines application msd = micro sd card version 04 = 7.5 pf line capacitance package f = flip chip 3= lead-free, pitch = 400 m, bump = 255 m
EMIF06-MSD04F3 package information doc id 018849 rev 1 7/9 4 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. package dimensions figure 13. footprint figure 14. marking 1.54 mm 40 m 1.54 mm 40 m 255 m 40 400 m 40 400 m 40 170 m 10 170 m 10 605 m 55 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y z w x w dot, st logo ecopack status xx = marking yww = datecode y = year, ww = week z = manufacturing location
ordering information EMIF06-MSD04F3 8/9 doc id 018849 rev 1 figure 15. tape and reel specification 5 ordering information note: more information is availa ble in the application notes: an2348: ?flip chip: package description and recommendations for use? an1751: "emi filters: recommendations and measurements" 6 revision history dot identifying pin a1 location user direction of unreeling all dimensionsare typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.69 1.65 0.20 st st st xxz yww xxz yww xxz yww e e e 1.65 st st st xxz yww xxz yww xxz yww e e e table 4. ordering information order code marking package weight base qty delivery mode EMIF06-MSD04F3 jw flip chip 3.2 mg 5000 tape and reel 7? table 5. document revision history date revision changes 12-july-2011 1 first issue.
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